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Driving the Heat out of Embedded Military Systems: Reducing Thermals

Start Date:9/15/2020

Start Time:2:00 PM EDT

Duration:60 minutes

Abstract:

Radar, electronic warfare, and intelligence, surveillance and reconnaissance (ISR) systems all depend heavily on superior signal processing solutions that often leverage commercial processors, graphics processors, FPGAs, etc. These devices provide unprecedented performance but also create headaches for military embedded systems designers when it comes to keeping the systems cool enough for intensive military processing applications. Reducing component temperatures in these systems is critical in military applications that are experiencing ever-shrinking size, weight, and power (SWaP) requirements. This webcast of industry experts will discuss the thermal challenges in modern military electronics applications and cooling strategies to solve them.

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Speakers

Steven Gudknecht

Steve Gudknecht , Product Marketing and Communications Manager, LCR Embedded Systems. Steve is Product Marketing and Communications Manager at LCR Embedded Systems. Steve has over 15 years of experience in promoting and managing the development of advanced packaging solutions for the embedded computing industry. He started his career as an applications engineer for the semiconductor assembly equipment industry.

Sebastien Buzit

Sebastien Buzit, Technology Manager, nVent Schroff. Sebastien is the Engineering Manager at nVent Schroff for the Calmark Birtcher product lines. He has 10+ years of experience with board retention, wedge locks, and conduction cooling. He has overseen the development of many innovative PCB retainers and extractors to meet today’s challenging requirement.

Greg Hoeschele

Greg Hoeschele, Lead Engineer, Aerospace and Defense Product Development Group, ACT. eg Hoeschele has been working for ACT since 2015 and has worked across various markets and industries developing passive and active two-phase technologies. He is well versed with the demands of the military and aerospace industry and has worked on a wide range of simple to highly complex embedded computing system level and sub-system level thermal management projects. B.S. Mechanical Engineering - Lafayette College, M.S. Mechanical Engineering - Cornell University



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