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Start Date:3/12/2020
Start Time:2:00 PM EDT
Duration:60 minutes
Abstract:
Industrial drives are showing up in environments that expose the drives’ semiconductors to harsh gases. Hence, special precautions are required. At the same time, designers don’t want to replace these drives anytime soon, so extended lifetimes are important. Today, popular semiconductor power modules for this application are gel-filled, which bring along reliability and robustness issues when used in harsh environments. ON Semiconductor’s Transfer-Molded Power Integrated Modules (TM-PIM) use traditional transfer-molded packaging to address these concerns. In this webcast, we’ll compare these two types of modules and demonstrate the benefits that the TM-PIM offers to industrial drives.
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Speaker
Jinchang Zhou Jinchang Zhou, Sr. Principle Development Engineer, ON Semiconductor
Speaker Bio: Jinchang Zhou is a New Product Development Engineer in ON Semiconductor’s Power Solutions Group responsible for power integrated module development. He has 10+ years of semiconductor industry experience including roles in high voltage high power packaging design, new product development, and applications in ON Semiconductor’s Power Solution Group. He is Standard technical panel member of multiple institutes. He received his PHD in electrical engineering from University of Arkansas in 2013. His main interests are in power semiconductors for renewable energy and industrial motors.
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Eliminate Reliability and Robustness Issues in Industrial Drives
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